Home List your patent My account Help Support us

ELECTRONICS

Audio - Video (137)
Computers and computer accessories (268)
Navigation and orientation (87)

Security and alarms (194)
Telecommunications (226)

480 patents listed under ELECTRONICS

		161. Package structure and package process (526 views)	2 years ago
		162. Semiconductor packaging structure and manufacturing method (514 views)	2 years ago
		163. Substrate and manufacturing method thereof (511 views)	2 years ago
		164. Semiconductor device package with matched passive components (510 views)	2 years ago
		165. SEMICONDUCTOR DEVICE PACKAGES WITH PROTECTIVE LAYER (500 views)	2 years ago
		166. Chip jacking method and module (499 views)	2 years ago
		167. SEMICONDUCTOR PACKAGE DEVICE AND SEMICONDUCTOR PROCESS (498 views)	2 years ago
		168. Bonding wires with different curved directions (497 views)	2 years ago
		169. Structure and manufacture method of circuit substrate (496 views)	2 years ago
		170. Semiconductor packaging structure with shielding (495 views)	2 years ago
		171. WIREBONDED SEMICONDUCTOR PACKAGE (495 views)	2 years ago
		172. OPTICAL DEVICE AND METHOD FOR MANUFACTURING THE SAME (493 views)	2 years ago
		173. Semiconductor element and sealing structure thereof (491 views)	2 years ago
		174. SEMICONDUCTOR PACKAGE HAVING PROXIMITY COMMUNICATION SIGNAL (489 views)	2 years ago
		175. Semiconductor packaging with outer routing wire (487 views)	2 years ago
		176. Circuit substrate (487 views)	2 years ago
		177. Substrate structure of semiconductor device package (486 views)	2 years ago
		178. Embedded substrate having circuit layer device (485 views)	2 years ago
		179. WIRING STRUCTURE, ASSEMBLY STRUCTURE AND METHOD (485 views)	2 years ago
		180. ANTENNA WITH A STACKING CONDUCTIVE STRUCTURE (485 views)	2 years ago
		181. Heat sink etching process (485 views)	2 years ago
		182. SEMICONDUCTOR PACKAGE SUBSTRATES HAVING LAYERED CIRCUIT SEGMENTS (484 views)	2 years ago
		183. Conductive bump has different dimensions (484 views)	2 years ago
		184. Making a Stackable Package (482 views)	2 years ago
		185. Semiconductor substrate structure (481 views)	2 years ago
		186. SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PROCESS (480 views)	2 years ago
		187. Semiconductor device and method the same (478 views)	2 years ago
		188. Optical module and optical sub-module thereof (477 views)	2 years ago
		189. SUBSTRATE STRUCTURE AND SEMICONDUCTOR PACKAGE STRUCTURE (474 views)	2 years ago
		190. SEMICONDUCTOR PACKAGE STRUCTURE HAS AT LEAST TWO BENDINGS (474 views)	2 years ago
		191. CIRCUIT BOARD AND PROCESS OF FABRICATING THE SAME (473 views)	2 years ago
		192. Semiconductor substrate cutting device (473 views)	2 years ago
		193. A semiconductor package structure includes a substrate (473 views)	2 years ago
		194. The electrical contacts have protrusion portions (473 views)	2 years ago
		195. Dielectric structure with different inside diameter (472 views)	2 years ago
		196. Semiconductor wire bonding structure and method (471 views)	2 years ago
		197. Conductive pads with tapered surfaces and varying widths (471 views)	2 years ago
		198. Semiconductor wrapper and manufacturing method thereof (469 views)	2 years ago
		199. Flip-chip bonding method and device (468 views)	2 years ago
		200. Suction head for sucking solder ball (468 views)	2 years ago

<1 2 3 456 7 8 9 10 11 12 >