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Semiconductor packaging structure with shielding

[Category : - ELECTRONICS]
[Viewed 205 times]

Provided are a semiconductor packaging structure and a manufacturing method thereof. The method comprises providing a wafer; performing first cut on a first surface of the wafer so as to form a plurality of cut grooves, enabling the cut grooves to divide the wafer into a plurality of chip units which comprise first surfaces, second surfaces turning the back to the first surfaces and sides located in the cut grooves; enabling a conducting shade layer to be formed on the wafer, enabling the conducting shade layer to be covered on the first surfaces and the sides of the chip units and filled in the cut grooves; performing second cut on the shade layer corresponding to the positions of the cut grooves; and enabling an earth lead on the second surfaces not covered by the shade layer in each chip unit so as to be connected with the shade layer. The manufacturing method can prevent the shade layer from being attached to primer, and good anti-warping capability and heat dissipation effect are achieved.

Patent publications:

CN 103000539

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rayfw (Taiwan)

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