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Suction head for sucking solder ball

[Category : - ELECTRONICS]
[Viewed 44 times]

The invention relates to a suction head for sucking a solder ball, a device and a semiconductor process. The suction head comprises a suction head body, a plurality of control elements and a plurality of supporting elements, wherein the suction head body is provided with a plurality of holes; a first opening of each hole is communicated to a vacuum source; a second opening of each hole is communicated to the outside; the control elements can move in the holes; and each supporting element is located in the second opening of each hole, for supporting each control element. Thus, manufacturing costs can be saved as the suction head is universal.

Patent publications:

CN 102664156

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rayfw (Taiwan)

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