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SEMICONDUCTOR PACKAGE DEVICE AND SEMICONDUCTOR PROCESS

[Category : - ELECTRONICS]
[Viewed 293 times]

A semiconductor package device includes a wiring structure, a semiconductor chip and an encapsulant. The semiconductor chip is electrically connected to the wiring structure. The encapsulant is disposed on the wiring structure and covers the semiconductor chip. A roughness (Ra) of a surface of the encapsulant is about 5 nm to about 50 nm.

Patent publications:

 US 11056446
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Seller:

rayfw (Taiwan)

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