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Substrate and manufacturing method thereof

[Category : - ELECTRONICS]
[Viewed 208 times]

A substrate structure and a manufacturing method thereof are provided. The substrate structure includes a substrate, a first insulation layer, a conductive part, a second insulation layer, a seed layer and a conductive layer. The substrate has a first circuit pattern and a second circuit pattern which are located opposite two surfaces of the substrate respectively. The first insulation layer is formed on the first circuit pattern, and has a first hole which exposes a first opening in the outer surface of the first insulation layer. The conductive part is formed in the first hole for electrically connecting with a chip, and is enclosed by the edge of the first opening. The second insulation layer is formed on the second circuit pattern and has a second hole. The seed layer is formed on the second hole on which the seed layer is formed for electrically connecting with a Printed Circuit Board.

Patent publications:

TW 2008151291

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rayfw (Taiwan)

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