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Chip jacking method and module

[Category : - ELECTRONICS]
[Viewed 233 times]

A chip jacking module is used for jacking a to-be-jacked chip. A first cutting channel is formed between the to-be-jacked chip and a first chip, and a second cutting channel is formed between the to-be-jacked chip and a second chip. The chip jacking module comprises an image acquisition device, an ejector pin device and a control unit. The image acquisition device acquires images of the first cutting channel and the second cutting channel. The ejector pin device is used for jacking the to-be-jacked chip. The control unit calculates a first width of the first cutting channel and a second width of the second cutting channel and judges whether the first width and the second width are smaller than a safety width; if the first width and the second width are larger than the safety width, the control unit controls the ejector pin device to jack the to-be-jacked chip in one time; and if at least one of the first width and the second width is equal to or smaller than the safety width, the control unit controls the ejector pin device to jack the to-be-jacked chip in a few times.

Patent publications:

CN 103208451

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rayfw (Taiwan)

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