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WIRING STRUCTURE, ASSEMBLY STRUCTURE AND METHOD

[Category : - ELECTRONICS]
[Viewed 283 times]

A wiring structure includes a first dielectric layer, a first circuit layer, a second dielectric layer and a conductive via. The first dielectric layer defines at least one through hole. The first circuit layer is disposed on the first dielectric layer. The second dielectric layer is disposed on the first dielectric layer to cover the first circuit layer, wherein a first portion of the second dielectric layer is disposed in the through hole of the first dielectric layer. The conductive via extends through the first portion of the second dielectric layer in the through hole of the first dielectric layer, and is electrically isolated from the first circuit layer.

Patent publications:

 US 11217520
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rayfw (Taiwan)

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