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Semiconductor wrapper and manufacturing method thereof

[Category : - ELECTRONICS]
[Viewed 204 times]

The invention relates to a semiconductor wrapper and a manufacturing method thereof. The semiconductor wrapper comprises a chip, a wrapper body, a conducting piece and a shielding membrane. The chip is arranged on the conducting piece and is provided with a heat dissipation piece running through the chip. The wrapper body wraps the chip and the conducting piece and has an outer side surface, and an upper surface and a lower surface which are opposite to each other, and the wrapper body has a first heat dissipation hole and a second heat dissipation hole. The first heat dissipation hole extends to the upper surface of the wrapper body from the heat dissipation piece, and the second heat dissipation hole extends to a zone outside the heat dissipation piece on the chip from the upper surface of the wrapper body. The shielding film forms an upper surface and an outer side surface of the wrapper body and is electrically connected with the conducting piece.

Patent publications:

CN 106298742

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rayfw (Taiwan)

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