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Heat sink etching process

[Category : - ELECTRONICS]
[Viewed 213 times]

The invention discloses a semiconductor packaging piece and a manufacturing method of the semiconductor packaging piece. The semiconductor packaging piece comprises a substrate, chips, a clad material and a cooling fin. The substrate is provided with an outer side face; the chips are located on the substrate; the chips are clad by the clad material, and the clad material is provided with an upper surface and an outer side face; the outer side face of the clad material shrinks inwards relative to the outer side face of the substrate; the cooling fin is arranged on the upper surface of the clad material and is provided with an outer side face; the outer side face of the cooling fin shrinks inwards relative to the outer side face of the clad material.

Patent publications:

CN 104377179

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rayfw (Taiwan)

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