PatentAuction.com lists patented inventions available for sale or licensing. Inventors can list their patented inventions (or patent pending) for sale. New inventions for sale are added on a daily basis !
Home    List your patent    My account     Help     Support us    

A semiconductor package structure includes a substrate

[Category : - ELECTRONICS]
[Viewed 269 times]

A semiconductor package structure includes a substrate, a semiconductor element, an encapsulant, an adhesion layer and a metal cap. The semiconductor element is disposed on the substrate. The encapsulant covers the semiconductor element. The adhesion layer is disposed on the encapsulant. The metal cap is attached to the encapsulant by the adhesion layer, and the metal cap is conformal with the encapsulant.

Patent publications:

 US 9953930
Asking price:

Make an offer

Rate this patent

Like Great invention
Viewed: 269 times

Seller:

rayfw (Taiwan)

Ask a question
or start a negotiation

Contact the seller

Share on social media








[ Home | List a patent | Manage your account | F.A.Q.|Terms of use | Contact us]

Copyright PatentAuction.com 2004-2017
Page created at 2025-04-04 20:53:08, Patent Auction Time.