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Semiconductor packaging with outer routing wire

[Category : - ELECTRONICS]
[Viewed 220 times]

The invention discloses a semiconductor packaging piece and a manufacturing method thereof. The semiconductor packaging piece comprises an upper base plate, a lower base plate, a packaging body, a routing wire and a protective layer, wherein the upper base plate is provided with an outer side surface; the lower base plate is provided with an upper surface and an outer side surface; the upper surface of the lower base plate is opposite to the upper base plate, and the outer side surface of the lower base plate protrudes out of the outer side surface of the upper base plate; the packaging body is formed between the upper base plate and the lower base plate and is provided with an outer side surface; the outer side surface of the packaging body is inclined from the upper base plate to the lower base plate in an outward expansion way; the routing wire is formed on the outer side surface of the packaging body and is electrically connected with the upper base plate and the lower base plate; the protective layer covers the outer side surface of the packaging body and the routing wire.

Patent publications:

CN 104347575

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rayfw (Taiwan)

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