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Embedded substrate having circuit layer device

[Category : - ELECTRONICS]
[Viewed 193 times]

The present invention relates to an embedded substrate having a circuit layer element with an oblique side surface and a method for making the same. The embedded substrate includes a dielectric layer and a circuit layer element. The dielectric layer has an upper surface and an accommodating opening. The circuit layer element is disposed in the accommodating opening. The circuit layer element has an upper surface, a chemical copper layer, a plating copper layer and an oblique side surface. The elevation of the upper surface is equal to or lower than that of the upper surface of the dielectric layer. The chemical copper layer includes Pd. The plating copper layer is disposed on the chemical copper layer. The oblique side surface is disposed on the upper surface of the circuit layer element, where is close to the wall of the accommodating opening, and extends downward from the upper surface of the circuit layer element to the wall of the accommodating opening. Therefore, the oblique side surface of the circuit layer element can avoid electrons gathering at a sharp edge of a conventional circuit layer element.

Patent publications:

TW 2009115918

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rayfw (Taiwan)

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