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Semiconductor device package with matched passive components

[Category : - ELECTRONICS]
[Viewed 320 times]

A semiconductor device package includes a first passive component having a first surface and a second passive component having a second surface facing the first surface of the first passive component. The first surface has a recessing portion and the second surface includes a protruding portion within the recessing portion of the first surface of the first passive component. A contour of the protruding portion and a contour of the recessing portion are substantially matched. A method of manufacturing a semiconductor device package is also disclosed.

Patent publications:

 US 11309295
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Seller:

rayfw (Taiwan)

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