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Semiconductor substrate cutting device

[Category : - ELECTRONICS]
[Viewed 63 times]

The invention provides a semiconductor substrate cutting device and a manufacturing method of a semiconductor wafer cutter. The manufacturing method comprises following steps that a semiconductor substrate with a surface is provided, the surface of the semiconductor substrate is provided with a plurality of crystalline grains which are mutually separated, a plurality of gaps are formed between the crystalline grains and the surface of the semiconductor substrate, sheets are cut to form support elements, and one sides of the support elements are attached to the surface of the semiconductor substrate and fill the gaps.

Patent publications:

 CN 103065957
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Seller:

rayfw (Taiwan)

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