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Circuit substrate

[Category : - ELECTRONICS]
[Viewed 214 times]

A circuit substrate includes a inner circuit structure, a first conductive layer, a second conductive layer, a first dielectric layer, a plurality of first conductive blind vias, a first plating seed layer, a second dielectric layer, a plurality of conductive blind vias, a second plating seed layer, a third conductive layer, a third plating seed layer and a fourth conductive layer. The first conductive blind vias are embedded in the first dielectric layer and connect to a portion of the first conductive layer. The first plating seed layer is disposed between each first conductive blind via and the first conductive layer. The second conductive blind vias are embedded in the second dielectric layer and connect to a portion of the second conductive layer. The second plating seed layer is disposed between each second conductive blind via and the second conductive layer. A portion of the third conductive layer is electrically connected to the first conductive layer by the first conductive blind vias. The third plating seed layer is disposed between the third conductive layer and each first conductive blind via. A portion of the fourth conductive layer is electrically connected to the second conductive layer by the second conductive blind vias.

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