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Substrate structure of semiconductor device package

[Category : - ELECTRONICS]
[Viewed 291 times]

A substrate structure includes a substrate, an encapsulating layer and a redistribution structure. The substrate has a first surface. The encapsulating layer surrounds the substrate and has a first surface. The redistribution structure is disposed on the first surface of the substrate and the first surface of the encapsulating layer. A gap exists in elevation between the first surface of the substrate and the first surface of the encapsulating layer.

Patent publications:

 US 11195771
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rayfw (Taiwan)

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