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All Patents for sale on PatentAuction.com.com
Order by : Date -
Views
Page : 6 out of 203 (40 patents per page)
201.
optical communication for autonomous vehicles
(124 views)
3 months ago
202.
System and method for decision making for autonomous vehicles
(108 views)
3 months ago
203.
Story of ABSR LABORATORIES PRIVATE LIMITED
(140 views)
3 months ago
204.
Reusable Connector for Domestic wet Mop Rifills
(141 views)
3 months ago
205.
“FOOTWEAR FOR FALL DETECTION ACCIDENT WARNING”
(137 views)
3 months ago
206.
STRENGTH-ENHANCING ARM SLEEVES
(132 views)
3 months ago
207.
COMPOSITE STRUCTURAL MATERIAL AND AGGREGATE THEREFOR
(129 views)
3 months ago
208.
REAL-TIME STOCK CHECKING APP
(154 views)
3 months ago
209.
WINDOW WIPERS FOR PASSENGER WINDOWS
(123 views)
3 months ago
210.
PORTABLE TYPING PRINTER
(142 views)
3 months ago
211.
QUICKSAND DETECTION HANDHELD DEVICE
(123 views)
3 months ago
212.
WATER DRYING SPONGE FOR SHOE SOLES
(126 views)
3 months ago
213.
MAT THAT ALERTS YOU WHEN YOUR CAT IS WAITING
(143 views)
3 months ago
214.
QUICK APPLICATION CLOTHES DRYER
(134 views)
3 months ago
215.
CHOKING AND BREATHING ALERT PANIC DEVICE
(145 views)
3 months ago
216.
Device To Determine If A Cat or Dog is a Stray or Has an Owner
(158 views)
3 months ago
217.
Système de compas règle amélioré
(96 views)
3 months ago
218.
2 in 1 CAR SEAT HANDS FREE PET CARRIER SYSTEM
(154 views)
3 months ago
219.
Hand-hewn log and mortar chinking vinyl siding
(134 views)
3 months ago
220.
Modular container
(278 views)
3 months ago
221.
Method and device for checking the shift of the... [(10)I346368]
(116 views)
3 months ago
222.
Flip-chip bonding process [(10)I347644]
(106 views)
3 months ago
223.
Manufacturing method of die-stacked structure [(10)I360170]
(107 views)
3 months ago
224.
Method of fabricating die having bump [(10)I358099]
(95 views)
3 months ago
225.
Chip package process [(10)I299887]
(110 views)
3 months ago
226.
FC packaging process, FC PKG structure & carrier... [(10)I298942]
(96 views)
3 months ago
227.
Degating device and cover structure thereof and... [(10)I343099]
(110 views)
3 months ago
228.
A fixture for multi-chip wire bond and process of WB [(10)I304254]
(97 views)
3 months ago
229.
An IC wafer sawing process [(10)I308775]
(97 views)
3 months ago
230.
Bridge-type wire bond equipment and method [(10)I305392]
(90 views)
3 months ago
231.
Method for electroplating an electrical connect... [(10)I360191]
(122 views)
3 months ago
232.
Circuit board & the method for processing a... [(10)I358108]
(103 views)
3 months ago
233.
PKG structure of integrated circuit chip includ... [(10)I317992]
(91 views)
3 months ago
234.
Method for detecting integrated circuit WB position [(10)I335071]
(99 views)
3 months ago
235.
Method for cutting a wafer and semiconductor package [(10)I309863]
(85 views)
3 months ago
236.
Ball mounting apparatus and method thereof [(10)I316742]
(88 views)
3 months ago
237.
Process for electroplating wafer [(10)I311343]
(90 views)
3 months ago
238.
Chip package and method for fabricating the same [(10)I311365]
(83 views)
3 months ago
239.
A punching method of semiconductor PKG carrier [(10)I335628]
(73 views)
3 months ago
240.
Wire-bounding method adapted to substrate boards... [(10)I311791]
(92 views)
3 months ago
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