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Waterless Cooling System for AI Infrastructure

[Category : - RENEWABLE ENERGY- Heating & Cooling- Pumps]
[Viewed 35 times]

Patent pending waterless cooling technology for AI processors, data centers, and high-performance computing systems. Solid state thermal management solution designed to replace liquid cooling using a passive hybrid metal heat dissipation structure.rnrnKey benefits include reduced water usage, improved reliability, passive operation, and compatibility with high density semiconductor and AI hardware environments.rnrnRelevant to AI cooling, data center cooling, thermal management, solid state cooling, semiconductor cooling, sustainable infrastructure, and energy efficient computing.

Financial information

The owner is open to multiple transaction structures, including licensing (exclusive or non-exclusive), strategic partnership, or full acquisition, depending on scope, field of use, and commercial alignment. Initial engagement is welcomed for technical evaluation or pilot discussion, with flexibility on final deal structure.

This invention has not been previously sold, licensed, or commercially marketed. It is newly introduced to the market following the filing of a U.S. provisional patent application.
The technology addresses a growing need for waterless and infrastructure efficient cooling driven by rapid expansion of AI, high-performance computing, and data center operations. Market demand is supported by increasing compute density, rising cooling costs, water availability constraints, and sustainability pressures across AI infrastructure, semiconductor packaging, aerospace, and defense sectors.

Commercial terms are flexible and subject to negotiation based on exclusivity, territory, field of use, and development pathway. The owner is open to structured arrangements, including staged licensing, evaluation agreements, or milestone-based commercialization.

The invention is currently protected under a U.S. provisional patent application. Supporting materials include technical documentation, drawings, and a one-page overview. Additional intellectual property such as a company name and online presence may be included as part of a broader transaction, depending on the nature of the agreement.

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Seller:

corohalltech (United States)

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