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Method and device for checking the shift of the... [(10)I346368]

[Category : - ELECTRONICS]
[Viewed 64 times]

A method and device for checking the shift of the wafer backside marking inspection, in that the method includes the steps of using two cameras and place on wafer topside and backside to catch both images; overlaying two images and making these images with the same scale, size, axis of the center of the two cameras; and displaying the overlay image in monitor for marking shift checking. It is easy to recognize that the shift of the shift of the wafer backside marks by the two cameras before cutting the wafer. So, it could be reduced of wasting wafers that are cut if the backside marking is in wrong place.

Patent publications:

TW 200839912

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rayfw (Taiwan)

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