PatentAuction.com lists patented inventions available for sale or licensing. Inventors can list their patented inventions (or patent pending) for sale. New inventions for sale are added on a daily basis !
Home    List your patent    My account     Help     Support us    

Flip-chip bonding process [(10)I347644]

[Category : - ELECTRONICS]
[Viewed 62 times]

A flip-chip bonding process is provided to attach a chip on a substrate. By means of stripping off an oxide on the surface of at least one bump of the chip by a cleaning element. When the chip attaches to the substrate thereby through the at least one bump which is under re-flow process, it facilitates the bonding well between the chip and the substrate because the oxide on the surface of the bump is destroyed.

Patent publications:

 TW 200908171
Asking price:

Make an offer

Rate this patent

Like Great invention
Viewed: 62 times

Seller:

rayfw (Taiwan)

Ask a question
or start a negotiation

Contact the seller

Share on social media








[ Home | List a patent | Manage your account | F.A.Q.|Terms of use | Contact us]

Copyright PatentAuction.com 2004-2017
Page created at 2025-01-08 15:50:43, Patent Auction Time.