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Manufacturing method of die-stacked structure [(10)I360170]

[Category : - ELECTRONICS]
[Viewed 56 times]

A manufacturing method of a die-stacked structure is provided. The method includes the following steps. At least two wafers having a plurality of dies are provided. The surface of each wafer has a plurality of die bonding lines and at least an edge bonding line. Each die is surrounded by a die bonding line. The edge bonding line is adjacent to the edge of the wafer. The corresponding die bonding lines of the two wafers and edge bonding lines of the two wafers are adhered with each other. The adhered wafers are adhered to a fixing film and the adhered wafers are cut along a plurality of cutting path so as to form a plurality of die-stacked structures. At least a portion of the edge bonding line is located at the cutting paths and the edge of the wafers.

Patent publications:

TW 200952056

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