PatentAuction.com lists patented inventions available for sale or licensing. Inventors can list their patented inventions (or patent pending) for sale. New inventions for sale are added on a daily basis !
Home    List your patent    My account     Help     Support us    

Method of fabricating die having bump [(10)I358099]

[Category : - ELECTRONICS]
[Viewed 95 times]

A method of fabricating dies having bumps is provided. First, a wafer having a first face and a second face opposite to the first face is provided. Next, a thickness of the wafer is removed. Further, the wafer is disposed into a carrier. Moreover, the wafer of which the thickness is removed is diced to form many dies. In addition, many bumps are formed on the first face of the diced wafer. After that, the wafer with the bumps is removed from the carrier, so as to separate the dies.

Patent publications:

 TW 200933768
Asking price:

Make an offer

Rate this patent

Like Great invention
Viewed: 95 times

Seller:

rayfw (Taiwan)

Ask a question
or start a negotiation

Contact the seller

Share on social media








[ Home | List a patent | Manage your account | F.A.Q.|Terms of use | Contact us]

Copyright PatentAuction.com 2004-2017
Page created at 2025-04-03 10:20:36, Patent Auction Time.