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Chip package process [(10)I299887]

[Category : - ELECTRONICS]
[Viewed 111 times]

A chip package process including following steps is provided. First, a package substrate including a carrying surface and multiple contacts disposing on the carrying surface is provided. Then, a chip is disposed on the carrying surface, wherein a surface of the chip away from the package substrate has an active region and multiple bonding pads are disposed around the active region. Next, the bonding pads are contacted to the corresponding contacts through multiple wires by wire bonding. Thereafter, a protective film is formed on the chip to cover the active region. Next, a molding compound is formed on the package substrate and the chip, wherein the bonding pads, the contacts, and the wires are covered by the molding compound. The protective film on the active region is exposed. Thereafter, the protective film is removed to expose the active region.

Patent publications:

TW 200735239

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rayfw (Taiwan)

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