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A fixture for multi-chip wire bond and process of WB [(10)I304254]

[Category : - ELECTRONICS]
[Viewed 98 times]

A fixture of multi-chip wire bond is used for wire bonding a carrier with at least one chip site on, which comprises a heat block supporting the carrier and a hoister siting inside the heat block. The hoister includes a platform and an up-down adjusting unit, wherein the up-down adjusting unit controls the up down of the platform and the platform supports the plurality of connecting elements of the carrier to prevent the cracking of the connecting elements during the wire bonding process.

Patent publications:

 TW 200743195
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Seller:

rayfw (Taiwan)

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