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An IC wafer sawing process [(10)I308775]

[Category : - ELECTRONICS]
[Viewed 97 times]

An IC wafer sawing process is provided. First, an O-ring is provided which the O-ring is formed with a blue film having a adhesive layer with two different adherences. Next, a wafer is provided, and a back surface of the wafer is adhered onto the blue film. Then, the wafer is sawed into a plurality of chip die. Further, the adherence attached to the O-ring is tighter than the one to the wafer at that the sawed chip die will not take off from the blue film, no water and chip die residue will not be trapped in between the blue film and the sawed chip die, and the slight die crack and die chip out at wafer sawing will be cured.

Patent publications:

TW 200814171

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rayfw (Taiwan)

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