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Bridge-type wire bond equipment and method [(10)I305392]

[Category : - ELECTRONICS]
[Viewed 90 times]

A bridge-type wire bond equipment wire bonds the chip. carrier including a wire bond area having a first waiting bond area and a second waiting bond area, and comprises a first wire bond machine, a second wire bond machine and a transporting device. The first wire bond machine includes a first working area and wire bonds the first waiting bond area of the chip carrier. The width of the first working area is less than the width of the wire bond area. The second wire bond machine includes a second working area and wire bonds the second waiting bond area of the chip carrier. The width of the second working area is less than the width of the wire bond area. The transporting device connects the first wire bond machine and the second wire bond machine, and transports the chip carrier into the second wire bond machine.

Patent publications:

TW 200741911

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rayfw (Taiwan)

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