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Method for electroplating an electrical connect... [(10)I360191]

[Category : - ELECTRONICS]
[Viewed 122 times]

The present invention relates to a method for electroplating an electrical connecting pad and semiconductor substrate having an electrical connecting pad. The method mainly includes the following steps: patterning a first metal layer on a first surface of a substrate, and patterning a second metal layer on a second surface of the substrate so as to form at least one electrical connecting pad and at least one connecting line; forming a first solder mask layer on the second metal layer, wherein part of the second metal layer is exposed outside the first solder mask layer; forming a third conductive layer on the first surface of the substrate; removing a first part of the third conductive layer, and the area of the first part including the electrical connecting pad and part of the connecting line; forming an electroplating layer on the electrical connecting pad; removing the third conductive layer which is left; and forming a second solder mask layer on the first surface of the substrate, and the electrical connecting pad is exposed outside the second solder mask layer. Whereby, the first solder mask layer does not peel, and the yield rate is increased.

Patent publications:

TW 201003804

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rayfw (Taiwan)

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