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Circuit board & the method for processing a... [(10)I358108]

[Category : - ELECTRONICS]
[Viewed 104 times]

The present invention relates to a circuit board and the method for processing a circuit board. The method comprises: (a) providing a circuit board having a core layer, a plurality of first connecting portions and a plurality of second connecting portions, wherein the core layer has a first surface and a second surface, the first connecting portions are disposed on the first surface, and the second connecting portions are disposed on the second surface; (b) forming a metallized layer on the second surface of the core layer so as to cover the second connecting portions; (c) forming a protecting film on the metallized layer; (d) forming a metal plating layer on the first connecting portions; (e) removing the protecting film; (f) forming a peelable solder mask on the first surface of the core layer so as to cover the metal plating layer; (g) removing the metallized layer; (h) forming an immersion tin layer on the second connecting portions; and (i) removing the peelable solder mask so as to get a processed circuit board. Whereby, the metallized layer is formed on the first connecting portions directly and more materials can be selected to form the metallized layer.

Patent publications:

TW 200943497

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rayfw (Taiwan)

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