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PKG structure of integrated circuit chip includ... [(10)I317992]

[Category : - ELECTRONICS]
[Viewed 91 times]

A package structure of integrated circuit (IC) chip including internal contacts is provided. Multiple metal layers are provided in a silicon substrate, and the metal layers are connected with the silicon substrate. Further, the silicon substrate and the IC chip are wrapped by a sealing element. Wherein, one end of the multiple metal layers is electrically connected with the IC chip, the other end of each metal layer is extended to plural openings provided on one side of the sealing element. Then, the plural internal contacts are formed in the opening. Thus, when the IC chip generates heat during operating, the connecting surface between the silicon and the IC chip would not have stress. On the other hand, because the metal layer is multiple layers, the volume of the package structure can be reduced during package.

Patent publications:

TW 200822308

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rayfw (Taiwan)

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