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Method for detecting integrated circuit WB position [(10)I335071]

[Category : - ELECTRONICS]
[Viewed 99 times]

The present invention provides a method for detecting integrated circuit wire-bonding position. The method includes: first obtaining the image of an integrated circuit wire-bonding area, assigning each pin in the image with different color level value, and corresponding the standard wire-bonding position coordinate value configured in the standard wire bonder or computer-aided design file to the pin in the image so as to obtain the corresponding color level value; then corresponding the wire-bonding position coordinate value configured in the wire bonder under test to the wire-bonding position in the image so as to obtain the corresponding color level value; and finally detecting whether the wire bonder under test has a correct wire-bonding position coordinate value by determining whether the color level values respectively corresponding to the two wire-bonding position coordinate values are identical. Therefore, the present invention can be applied in detecting multi-tier, and has the advantage of fast detection without erroneous detection and lost detection.

Patent publications:

TW 200841448

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rayfw (Taiwan)

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