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Method for cutting a wafer and semiconductor package [(10)I309863]

[Category : - ELECTRONICS]
[Viewed 85 times]

A method for cutting a wafer is provided. Two layers of die attach films with different curing temperatures are applied to the backside of the wafer. The layer of die attach film directly attached to the backside of the wafer is fully cured after baking while the other layer of die attach film directly attached to the dicing tape is partially cured whereby the dies cut from the wafer are free of backside chipping during wafer-cutting process. The present invention further provides a semiconductor package.

Patent publications:

 TW 200737329
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Viewed: 85 times

Seller:

rayfw (Taiwan)

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