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Ball mounting apparatus and method thereof [(10)I316742]

[Category : - ELECTRONICS]
[Viewed 88 times]

A ball mounting apparatus is provided to mount a plurality of solder balls to a plurality of substrate units on a substrate bar. The ball mounting apparatus includes an upper pattern plate, a lower pattern plate, and a sensor. The upper pattern plate has a plurality of suction elements and a plurality of vacuum bumps connected to the suction elements. The suction element has a plurality of holes corresponding to different vacuum bumps for absorbing the solder balls. The sensor is set under the substrate bar for sensing the substrate units if are bad. The sensing result will transmit to the upper pattern plate then the suction elements will not absorb the solder balls on the lower pattern plate.

Patent publications:

TW 200809987

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rayfw (Taiwan)

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