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Process for electroplating wafer [(10)I311343]

[Category : - ELECTRONICS]
[Viewed 90 times]

A process for electroplating wafer includes the step of providing a wafer; forming a conducting layer on the upper surface of the wafer; forming a patterned photoresist layer on the conducting layer; testing whether the adhesion of the photoresist layer is larger than a predetermined value; if the adhesion of the photoresist layer is smaller than the predetermined value, removing the photoresist layer and then re-forming a patterned photoresist layer on the conducting layer; and forming an electroplating layer on the area of the conducting layer not covered by the photoresist layer thereon.

Patent publications:

TW 200816302

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rayfw (Taiwan)

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