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A punching method of semiconductor PKG carrier [(10)I335628]

[Category : - ELECTRONICS]
[Viewed 73 times]

A punching method of semiconductor package carrier is provided. The method includes steps: providing a long strip package carrier, providing a mold including an upper mold and a lower mold which having a pressing surface respectively, disposing the carrier between the upper mold and the lower mold, pressing the carrier by the upper mold and lower mold, wherein the upper mold and the lower mold selectively disposing at least one elastomer pressing the carrier on the pressing surface, and finally, punching a cutting path forming on the carrier. Thereby, the elastomer disposes for the upper mold and the lower mold respectively, the elastomer absorbs the punching force when the upper mold and the lower mold are closing. The carrier is decreases damage, crack, and warp, so as to, it is increases product and quality.

Patent publications:

TW 200822243

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rayfw (Taiwan)

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