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Wire-bounding method adapted to substrate boards... [(10)I311791]

[Category : - ELECTRONICS]
[Viewed 92 times]

A wire-bounding method adapted to substrate boards with protective layers is disclosed. The method includes: providing a substrate board, wherein the substrate board has a substrate, a copper circuit layer formed on the substrate, and a solder mask covered on the copper circuit layer, and the solder mask has an opening for exposing a contact of the copper circuit layer; next, forming a protective layer on the contact; finally, using one side of a copper wire to directly melt on the contact of the copper circuit layer. During wire-bounding process, the protective layer automatically dissipates due to heating of a machine for the substrate board and micro-vibration of the copper wire for the protective layer. Hence, the copper wire can bound with the contact to form a firm Cu-Cu joint interface for solving prior problems such as finger fall off.

Patent publications:

TW 200809991

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rayfw (Taiwan)

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