Home List your patent My account Help Support us

MEMS hermetic PKG structure & method thereof [(10)I331378]

[Category : - ELECTRONICS]
[Viewed 90 times]

MEMS hermetic packaging structure comprises a carrier, a MEMS chip, a lid and a sealing layer. The carrier has an upper surface, a lower surface and a dam formed on the upper surface, wherein a space is formed within the dam. The MEMS chip sited on the upper surface of the carrier is surrounded by the dam. The lid is jointed to the dam of the carrier, which has a first surface, a second surface and at least one air hole unit communicating with the first surface, the second surface and the space. The sealing layer is formed on the first surface of the lid and seals the air hole unit. In this invention, the air hole unit is used to enable the space of the carrier to form a vacuum rapidly and prevent the MEMS chip being polluted while forming the sealing layer. Besides, the sealing layer sealing the air hole unit under vacuum can steady control the vacuity of the space, reduce the packaging process and achieve the aim of hermetic package.

Patent publications:

TW 200830478

Asking price:

Make an offer

Rate this patent

Great invention
Viewed: 90 times

Seller:

rayfw (Taiwan)

Ask a question
or start a negotiation

Contact the seller

Share on social media