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Semiconductor chip package & HS wtih elastic supt [(10)I310235]

[Category : - ELECTRONICS]
[Viewed 82 times]

A semiconductor chip package mainly includes a semiconductor chip and a heat slug disposed on a substrate, and a package body. The semiconductor chip is electrically connected to the substrate. The heat slug is located above the semiconductor chip and securely attached to the substrate. Anelastic support is securely attached to the lower surface of the heat slug for elastically supporting the heat slug. The package body encapsulates the semiconductor chip, the heat slug and the elastic support against at least a portion of the substrate such that at least a portion of the upper surface of the heat slug is exposed from the package body.

Patent publications:

TW 200729435

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rayfw (Taiwan)

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