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Quad flat non-leaded package and manufactur... [(10)I419290]

[Category : - ELECTRONICS]
[Viewed 83 times]

A quad flat non-leaded package including a leadframe, a chip, an encapsulant and a protective layer is provided. The leadframe includes a plurality of leads. Each lead has a lower surface and the lower surface is separated into a contact area and a non-contact area. The chip is disposed on the leadframe and electrically connected to the leadframe. The encapsulant encapsulates the chip and the leads, and fills among the leads. The contact area and the non-contact area of each lead are exposed by the encapsulant. The protective layer covers the non-contact area of each lead.

Patent publications:

TW 201218339

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rayfw (Taiwan)

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