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Optical sensor module and method for manufacturi... [(10)I706153]

[Category : - ELECTRONICS]
[Viewed 98 times]

An optical sensor module includes a lid defining a first chamber and a second chamber isolated from the first chamber, a light emitting component and a light sensing component. The light emitting component is disposed within the first chamber and the light sensing component is disposed within the second chamber. The lid includes a first lens with a non-convex upper surface and a convex lower surface facing the light emitting component. The upper surface of the first lens may be substantially planar. The lid may further include a second lens and a capping substrate, wherein the top of the first chamber and a top of the second chamber are demarcated by the capping substrate, and wherein the capping substrate defines a first penetrating hole in which the first lens is formed or disposed and a second penetrating hole in which the second lens is formed or disposed.

Patent publications:

TW 201638605

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rayfw (Taiwan)

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