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Circuit board and method for manufacturing the same [(10)I342172]

[Category : - ELECTRONICS]
[Viewed 74 times]

A method for manufacturing a circuit board comprises the steps as following. A first line layer is manufactured on a substrate. A dielectric layer is formed on the surface of the first line layer by electrophoretic deposition procedure. A second line layer is formed on the dielectric layer and the substrate. Follow-up procedures, such as forming a solder mask, are proceeded. Thereby to reduce the thickness of the circuit board, and increase the density of the circuit layout.

Patent publications:

 TW 200830958
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rayfw (Taiwan)

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