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Semiconductor structure having a metal ring [(10)I442523]

[Category : - ELECTRONICS]
[Viewed 62 times]

The present invention relates to a semiconductor structure having a metal ring. The semiconductor structure includes a substrate, at least one chip and a metal ring. The substrate has a first surface. The chip is disposed on the first surface of the substrate, and electrically connected to the substrate. The metal ring has a first portion and a second portion. The first portion is disposed on the first surface of the substrate, and has a first coefficient of thermal expansion. The second portion is disposed on the first portion. The material of the second portion is different from that of the first portion. The second portion has a second coefficient of thermal expansion, and the second coefficient of thermal expansion is greater than the first coefficient of thermal expansion. Whereby, warpage of the substrate can be avoided, so that the yield rate is increased.

Patent publications:

TW 201212172

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rayfw (Taiwan)

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