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Semiconductor PKG and method for packaging the same [(10)I380426]

[Category : - ELECTRONICS]
[Viewed 61 times]

A semiconductor includes a chip, a carrier, a bonding wire and a molding compound. The chip includes a pad. The carrier includes a finger and has an upper surface and a lower surface opposite to the upper surface, wherein the upper surface supports the chip. The bonding wire is extended from the finger to the pad for electrically connecting the chip to the carrier, wherein the bonding wire defines a projection portion on the upper surface of the carrier, a straight line is defined to pass through the finger and pad, there is a predetermined angle between the straight line and the projection portion being along the tangent line at the finger. The molding compound seals the chip and the bonding wire, and covers the carrier.

Patent publications:

TW 201108368

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rayfw (Taiwan)

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