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Circuit board and process thereof [(10)I373836]

[Category : - ELECTRONICS]
[Viewed 58 times]

A circuit board including a dielectric layer, a circuit layer and an insulation layer is provided. The circuit layer is disposed on the dielectric layer and has a pad region and a trace region. The insulation layer is disposed on the circuit layer and covers the trace region, wherein the thickness of the pad region is smaller than the thickness of the trace region.

Patent publications:

 TW 201013875
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Seller:

rayfw (Taiwan)

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