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Semiconductor substrate & semiconductor PKG... [(10)CN105489580B]

[Category : - ELECTRONICS]
[Viewed 84 times]

The invention relates to a semiconductor substrate and a semiconductor packaging structure. The semiconductor substrate includes: an insulating layer, a first circuit layer and a plurality of conductive bumps. The insulating layer has a first surface, and the first circuit layer is arranged adjacent to the first surface of the insulating layer. The conductive bumps are arranged on the first circuit layer, each conductive bump has a first width and a second width, a first direction extending along the first width is vertical to a second direction extending along the second width, and the first width is larger than the second width.

Patent publications:

CN 105489580

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rayfw (Taiwan)

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