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Semiconductor structure & PKG structure hav... [(10)CN102148222B]

[Category : - ELECTRONICS]
[Viewed 105 times]

The invention relates to a semiconductor structure and a semiconductor packaging structure having proximity communication signal input ends. The semiconductor structure comprises a plurality of proximity communication signal input ends which are arranged on a surface of the semiconductor structure, wherein each proximity communication signal input end is provided with a first electrode and a second electrode; the first electrode is exposed on the surface and used for being connected with an external component electrically; the second electrode is spaced from the first electrode by a distance; and the second electrode and the first electrode form a capacitor to provide capacitive coupling proximity communication. The semiconductor structure and the semiconductor packaging structure have an effect of proximity communication and do not have the problem that accurate alignment is required in the prior art. A capacitance value of the proximity communication of the semiconductor structure and the semiconductor packaging structure is fixed.







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