Home List your patent My account Help Support us

Circuit board and its making method [(10)CN100584156C]

[Category : - ELECTRONICS]
[Viewed 78 times]

The invention discloses a method for making circuit boards, a first circuit layer is formed on the basic board, then, an electrophoretic deposition process is carried out, an insulation layer is formed on the outside of the first circuit layer. Then a second circuit layer is formed on the insulation layer and the surface of the basic board, at last, the continuous process such as forming a welding cover. The thickness of the circuit board is reduced and the density of the circuit layout is increased through the method.

Patent publications:

CN 100584156

Asking price:

Make an offer

Rate this patent

Great invention
Viewed: 78 times

Seller:

rayfw (Taiwan)

Ask a question
or start a negotiation

Contact the seller

Share on social media