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Semiconductor encapsulating structure and ... [(10)CN102013420]

[Category : - ELECTRONICS]
[Viewed 70 times]

The invention relates to a semiconductor encapsulating structure and an encapsulating method thereof. The semiconductor encapsulating structure comprises a wafer, a bearing piece, welding lines and sealing glue, wherein the wafer comprises a gasket, the bearing piece comprises fingers and has an upper surface and a lower surface which are opposite to each other, the upper surface bears the wafer, the welding lines extend to the gasket from the fingers and are used for electrically connecting the wafer to the bearing piece, the projection of the welding lines on the upper surface of the bearing piece is a projection part which forms a preset included angle between the tangential direction at the fingers and a straight line penetrating through the fingers and the gasket, and the sealing glue wraps the wafer and the welding lines and covers the bearing piece. The semiconductor encapsulating structure and the encapsulating method avoid short circuit between the welding lines.

Patent publications:

CN 102013420

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