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Circuit board and preparation process thereof [(10)CN101783332B]

[Category : - ELECTRONICS]
[Viewed 82 times]

The invention discloses a circuit board, which comprises a dielectric layer, a circuit layer and an insulating layer, wherein the circuit layer is configured on the dielectric layer and is provided with a welding pad area and a wiring area; the insulating layer is configured on the circuit layer and covers the wiring area; and the welding pad area is thinner than the wiring area.







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