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Semiconductor package and semiconductor process [(10)CN108511423B]

[Category : - ELECTRONICS]
[Viewed 76 times]

The present disclosure relates to a semiconductor package and a method of manufacturing the same. In some embodiments, a semiconductor package includes a substrate, at least one die, a sealing ring and an inductor. The at least one die is mounted on the substrate and includes a plurality of component structures operating with acoustic waves. The component structures are arranged on a side of the at least one die that faces the substrate. The sealing ring is disposed between the at least one die and the substrate and surrounds the component structures. The inductor is disposed in the substrate.

Patent publications:

CN 108511423

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rayfw (Taiwan)

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