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Redistribution layer structure [(10)CN106971982B]

[Category : - ELECTRONICS]
[Viewed 83 times]

The present disclosure relates to redistribution layer structures useful in semiconductor substrate packages, semiconductor package structures, and chip structures. In an embodiment, a redistribution layer structure includes a dielectric layer, an anti-plating layer, and a conductive material. The dielectric layer defines one or more trenches. The conductive material is disposed in the trench(es), and the anti-plating layer is disposed on a surface of the dielectric layer.

Patent publications:

 CN 106971982
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rayfw (Taiwan)

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